Inhibition of Delayed Cracking in Low Expansion Borosilicate Glass by 266 nm Deep UV Laser Marking
Abstract:
Low expansion borosilicate glass is widely used in precision instruments and thermal-sensitive devices due to its excellent thermal stability. However, laser marking such materials presents challenges, particularly with the risk of inducing thermal stress that can lead to delayed cracking. This article discusses the use of 266 nm deep ultraviolet (DUV) laser marking technology for inscribing identification numbers on low expansion borosilicate glass thermal-sensitive components and explores methods to suppress the thermal stress that could cause delayed cracking.
Introduction:
Low expansion borosilicate glasses are preferred for applications where dimensional stability is critical, such as in the manufacturing of precision instruments and thermal sensors. The 266 nm DUV laser offers a high precision marking solution with minimal heat-affected zones. However, the high energy density of DUV lasers can still induce significant thermal stress in the glass, potentially leading to micro-cracks that may propagate over time. This article aims to provide insights into the optimal laser parameters and post-processing techniques to mitigate the risk of delayed cracking in these sensitive glass components.
Materials and Methods:
The study utilizes a 266 nm DUV laser marking machine to inscribe identification numbers on low expansion borosilicate glass samples. The laser's energy density, pulse duration, and repetition rate are varied to determine their impact on the induced thermal stress and the likelihood of delayed cracking. The samples are then subjected to thermal cycling tests to evaluate the resistance to cracking.
Results:
The results indicate that by carefully adjusting the energy density and pulse parameters of the 266 nm DUV laser, it is possible to mark low expansion borosilicate glass without inducing immediate or delayed cracking. A lower energy density and a higher pulse repetition rate were found to reduce the peak temperature reached in the glass, thereby minimizing thermal stress. Additionally, the use of a controlled cooling environment post-marking was shown to further reduce the risk of delayed cracking by promoting stress relief in the glass.
Discussion:
The discussion focuses on the importance of selecting appropriate laser parameters to balance the need for a clear and permanent mark with the requirement to minimize thermal stress in the glass. The study highlights the significance of the cooling rate after laser marking, suggesting that a rapid yet controlled cooling process can significantly reduce the residual stress in the marked area. The findings also emphasize the need for a thorough understanding of the material's thermal properties to predict and prevent delayed cracking.
Conclusion:
The study concludes that with careful control of the laser marking parameters and post-treatment processes, it is feasible to mark low expansion borosilicate glass with a 266 nm DUV laser without causing significant thermal stress or delayed cracking. This approach ensures the integrity and reliability of the glass components used in precision and thermal-sensitive applications.
Keywords: Laser marking machine, 266 nm DUV laser, Low expansion borosilicate glass, Thermal stress, Delayed cracking, Precision instruments, Thermal-sensitive devices.
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